抄録
Hi-speed and highly sensitive visual inspection tools are in practical use in the field of semiconductor wafer inspection. Defect review is a critical step to grasp the defect condition, that is, to know what types of defects are occurred on the wafer. However, it is not practical to review whole defects on the wafer because of a quantitative gap between the detected defects and defects to be reviewed within certain practical time. To bridge this gap, a visual pattern detection algorithm of spatially distributed defect points and an optimum defect sampling plan are proposed. Experimental result shows that partial defect review is enough to grasp the defect occurrence condition all over the wafer. by applying the proposed method for defect review.
