2024 年 144 巻 3 号 p. 228-233
In this paper, a newly developed 3rd Gen. RC-IGBT is presented. To reduce the power loss and improve the heat dissipation of RC-IGBTs, we introduced four approaches, controlling Gate-capacitances, thin wafer technique, high-density diode arrangement, and low carrier injection anode and cathode. The superior performance of the 3rd Gen. RC-IGBT is very promising for the carbon neutral.
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