抄録
The problem of suppressing resonances of the power/ground planes in a printed circuit board (PCB) by coating high resistive metal films onto the inner sides of copper layers of the two planes has theoretically been studied. The Q-factor that determines the strength of the resonance, is derived from the surface resistance of the composite conductor. To achieve the smallest Q-factor of a given resonance mode, there is an optimum thickness for a fixed conductivity or reversibly an optimum conductivity for a fixed thickness, for the coating metal films. The numerical results for the reduction rate of the quality factor and the input impedance of a test board have demonstrated the effectiveness of the high resistive metal coating to suppress the resonances of the power/ground planes in PCBs.
