抄録
A new micro hot-embossing process which combines the high accuracy of silicon micromachining process and low cost production of forming process was reported. A movable cantilever-array structure with vertical mirrors were designed under the limitation of hot-embossing fabrication and material properties of polymer. The cantilever has non-uniform width optimized for electrostatic actuation and high-density array configuration. Two metal molds were transferred by electroplating from silicon structures which is micromachined by DRIE and anisotropic wet etching. The polymer optical switch array chip was produced by hot-embossing between the two molds and laser cutting. Finally, the operation of the assembled 8 × 8 optical switch system was demonstrated.
