Synthesis and Characterization of Carbon Nanotube-Cu Composite using Supercritical Fluid Deposition

抄録

We propose a new approach to synthesize a carbon nanotube (CNT) - copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. The measured density of the composite is 8.2±0.3 g/cm³, and the volume percentage of voids is 3∼6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is 28.4∼42.1 mm²KW^-1. It shows the potential ability of the CNTs-Cu composite for thermal interface material.