低温接合技術と光エレクトロニクスデバイス応用に関するレビュー

抄録

Low-temperature bonding is an important fabrication technique for advanced microelectronic, MEMS (Micro electro mechanical systems) and optoelectronic devices. Recently, many low-temperature bonding methods such as surface activated bonding have been studied to create unique device structures for a wide range of photonics applications. This paper focuses on low temperature bonding technologies and reviews the state-of-the-art applications in optoelectronic devices.