抄録
Delamination damages in a juncture between different materials will raise problems in electric products, such as semiconductor plastic package. In this study, we are proposing a tactic to achieve robust juncture between leadframe and epoxy resin based on nano-structure control of leadframe surface. In the result, nano-structure of plated layer on leadframe can be controlled by a strict condition of electroplating bath. The nano-structure controlled leadframe surface shown remarkable robust junction to the epoxy resin successfully.
