誘電泳動アセンブリにおける金ナノ粒子ダイナミクスの数値シミュレーション

抄録

The functional granular devices assembled by dielectrophoresis are expected to be using as high performance sensors. For the optimum fabrication of these devices, it is necessary to understand the behavior of nanoparticles in dielectrophoretic assembly. In this study, we evaluated the validity of the present analytical model, and investigated the influence of various setting parameters on particle coagulation. Many particles adhered to the edge of pit due to the formation of strong electric field. The transport and aggregation properties of Au nanoparticles were obtained theoretically and quantitatively. These analytical results qualitatively agreed with our experimental ones.