抄録
In this paper, a new tensile tester for thin films is presented. This tensile tester has a grip that fixes a thin film specimen using electrostatic force. The tester was constructed in a scanning electron microscope (SEM) chamber. Using this tester, the tensile strengths of polycrystalline silicon (poly-Si) thin films have been measured. The tested part of the specimen is 30-300μm long, 5μm wide and 2μm thick. The fracture of the poly-Si thin film was brittle. The mean tensile strength was 2.0-2.6GPa, depending on the length of the tested part. The size of the critical flaw that initiates fracture of the poly-Si thin film is 28-47nm, rather small than the grain size of the poly-Si thin film.
