3 Dimensional Wire Array for Connection between Multi Layers

抄録

We have proposed the concept of distributed micro motion systems (DMMS) composed of micro cell array. We focused on the multi-layered fabrication process to integrate such micro devices as actuators, sensors and circuits for implementation of a micro cell array. In this case, each devices are produced on a separate substrate and connected together after fabrication. This paper describes the 3 dimensional (3-D) wire array which have been developed for the interconnection between these substrates.