IEEJ Transactions on Sensors and Micromachines
Online ISSN : 1347-5525
Print ISSN : 1341-8939
ISSN-L : 1341-8939
SILICON MICRO MOTHERBOARDS FOR THREE-DIMENSIONAL ASSEMBLING OF MICRO SYSTEMS
Hiroshi ToshiyoshiYoshio MitaMinoru OgawaHiroyuki Fujita
Author information
JOURNALS FREE ACCESS

1998 Volume 118 Issue 10 Pages 444-448

Details
Abstract

We propose a new method to develop three-dimensional micro systems by using hybrid assembling technique: IC or MEMS chips are patterned into connector structures on the fringes by anisotropic dry etching of silicon and orthogonally inserted into the slots in a micro base-chip to compose a miniaturized motherboard. Mechanical and electrical contact was completed by electroplating of copper. Small contact resistance (0.18Ω) and stray capacitance (50pF) were obtained. This technique relaxes the restriction due to the incompatibility between fabrication process of MEMS and that of integrated circuits, because those chips on the motherboard can be developed independently.

Information related to the author
© The Institute of Electrical Engineers of Japan
Previous article Next article
feedback
Top