抄録
A new chucking system for tensile testing of insulating thin films using electrostatic force has been developed. The free end of a cantilever beam specimen has an electrode, which is fix to a probe on which a pair of electrodes is fabricated to apply the voltage. The system is applied to tensile testing of plasma CVD SiO2 thin films. The tested part of the specimen is 0.65μm thick, 1-5μm wide and 30-300μm long. The mean tensile strength of the specimen is 1.6-2.3GPa depending on the specimen size. The strength is higher than that of the bulk materials. The fracture toughness of the film is 1.4-2.0MPa√m, which is calculated from the fracture strength of notched specimens.
