抄録
A fabrication process of tungsten probes for surface profile measurements has been improved. The probe contour is designed to have an optimum shape for the use of tapping stylus. An improved DC electropolishing is applied for the elimination of surface impurities and smaller stylus radius with exponential contour, which uses an electrical flushing and a surface tension control of the electrolyte. The process is experimentally confirmed to have advantages for the fabrication of the stabilized stylus contour, typically with a stylus radius of 30nm. They have smoother contours compared with those fabricated by AC electropolishing.
