TIEGA技術を用いた三次元微細加工
2000 年 120 巻 7 号 p. 375-376
詳細
2000 年 120 巻 7 号 p. 375-376
We have carried out three-dimensional (3-D) micromachinig of PTFE with the TIEGA process, a LIGA-like process which by replaces hard x-ray lithography with synchrotron radiation (SR) direct-photo etching. The etching rates are of the order of 100μm/min. A metallic wire covered with a PTFE sheet is rotated and/or moved while being irradiated with SR through a mask. The capabilities of these technologies and initial fabrication results are described in this paper.
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