抄録
It is crucial to enhance capability to create products having potentiality to be de-fact standards or to be used as a platform. This paper discusses issues of business creation process from a technology seeds. We have investigated a Japanese copper smelting manufacturer, who expanded its business domain to semiconductor packaging utilizing COF (chip-on-film) technology, and succeeded to grow the business with world-wide market share of 80%. Currently, COF is a key technology for flat panel displays.
