Niメッキ接合SiCパワーモジュールを適用した三相インバータの特性評価

抄録

In recent years, in order to realize a low-carbon society, power electronics equipment is required to have high efficiency and miniaturization. Therefore, next generation power modules using wide bandgap semiconductors with characteristics such as low loss, high heat resistance and high speed have been drawing attention. In this paper, a three - phase inverter was fabricated by applying SiC power module using Ni micro - plating bonding with low parasitic inductance and high heat resistance. Next, the characteristics of inverter efficiency are evaluated by experiments and reported.