The thermal shock resistance of high thermal conductive SiC ceramics by the water quench method was studied in comparison with other SiC ceramics. The critical temperature difference (ΔTC) of the flexural strength was dependent on the kinds of SiC ceramics. The high thermal conductive SiC ceramics had the highest ΔTC value of 680°C. The hot-pressed SiC and pressureless-sintered SiC ceramics with smaller thermal conductivities had the ΔTC values of 450° and 350°C, respectively. The thermal shock fracture resistance parameters (R′) calculated from the thermal conductivities at 500°C were 22kW/m for high thermal conductive SiC, 16kW/m for hot-pressed SiC and 12kW/m for pressureless-sintered SiC ceramics, which agreed qualitatively with the ΔTC values. The ratio of the calculated stress intensity factor (KI) for the crack initiation at the water quenching to the critical stress intensity factor (KIC) obtained from the flexural strength was in the range of 60-80%, and were approximately constant in any examined SiC ceramics.