Transient Heat Transfer of the Microprocessor System Investigation Regarding Natural Convection with Slate Style Chassis

Abstract

This paper explores system level transient heat transfer behavior under natural convection cooling with slate style chassis assuming a tablet device design. Steady state analysis based on heat conduction simulation is conducted to see the effect on microprocessor silicon die temperature and skin temperature of the chassis by internal structure difference and determine final configuration for transient simulation. After that, transient state analysis is conducted assuming the case that a microprocessor starts running TDP (Thermal Design Power) equivalent application workload after system reaches steady state with static screen idle power consumed by the microprocessor.