Multi-channel Hybrid Integrated Light Source for Ultra-high-bandwidth Optical Interconnections and Its Structural Optimization for Low Power Consumption by Considering Thermal Interference between LD Arrays

Takanori Shimizu; Masashige Ishizaka; Nobuaki Hatori; Makoto Okano; Tsuyoshi Yamamoto; Masahiko Mori; Yutaka Urino; Takahiro Nakamura; Yasuhiko Arakawa

doi:10.5104/jiepeng.7.94

Technical Papers

Multi-channel Hybrid Integrated Light Source for Ultra-high-bandwidth Optical Interconnections and Its Structural Optimization for Low Power Consumption by Considering Thermal Interference between LD Arrays

Takanori Shimizu, Masashige Ishizaka, Nobuaki Hatori, Makoto Okano, Tsuyoshi Yamamoto, Masahiko Mori, Yutaka Urino, Takahiro Nakamura, Yasuhiko Arakawa

Author information

Takanori Shimizu
Photonics Electronics Technology Research Association (PETRA)
Masashige Ishizaka
Photonics Electronics Technology Research Association (PETRA)
Nobuaki Hatori
Photonics Electronics Technology Research Association (PETRA)
Makoto Okano
National Institute of Advanced Industrial Science and Technology (AIST)
Tsuyoshi Yamamoto
Photonics Electronics Technology Research Association (PETRA)
Masahiko Mori
National Institute of Advanced Industrial Science and Technology (AIST)
Yutaka Urino
Photonics Electronics Technology Research Association (PETRA)
Takahiro Nakamura
Photonics Electronics Technology Research Association (PETRA)
Yasuhiko Arakawa
Institute of Industrial Science, The University of Tokyo

Keywords: Optical Interconnection, Photonic Integration, Flip-chip Bonding, Optical Surface Monting, Finite Element Method, Thermal Resistance

JOURNAL FREE ACCESS

2014 Volume 7 Issue 1 Pages 94-103

DOI https://doi.org/10.5104/jiepeng.7.94

Details

Abstract

A multi-channel hybrid integrated light source using a novel spot-size converter with a SiO_x slab layer for a wide fabrication margin has been developed that has high output power uniformity. The configuration of the light source was optimized to minimize power consumption by considering of the thermal interference between the channels in a laser diode (LD) array and also between the LD array chips. On the basis of the optimization, a 1,000-channel light source was demonstrated to have an over- 10-Tbit/s bandwidth optical interconnection. The hybrid integrated light source should be easily adaptable to a photonics-electronics convergence system for ultra-high-bandwidth interchip interconnections.

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