2009 年 75 巻 10 号 p. 1201-1205
The ultra-smoothness grinding method based on the new concept, which can finish to almost the same smoothness formed by polishing method, in the previous research, is developed as the countermeasure answering the recently strong requirement about high efficiency production of high quality components. The surface roughness of various kinds of materials formed by the method using the #140 diamond wheel is ascertained to attain below about 50nm(Rz). Furthermore, in the 2nd to 4th reports, the influence of grinding parameters such as wheel speed, normal feed to grinding direction and parallel step feed on the surface roughness is investigated. In the report, the possibility of ultra-high depth of cut of grinding of brittle materials such as fine ceramics and glass is examined. In even the ultra-high depth of cut of 1000 μm, the surface roughness of silicon carbide ceramic and Al2O3-TiC ceramic formed by the ultra-smoothness grinding method using #140 metal bonded diamond wheel is found to attain below 60nm (Rz) and 80nm (Rz) in three dimensional measurement of 256μm square, respectively. And also the surface roughness of a glass becomes below 50nm (Rz) in the range of depth of cut below 30μm.