抄録
Cerium Oxide (CeO2) slurry is frequently used for making high precision surface finishes of glass substrate applied for Hard Disk Drive (HDD) and Flat Display (FD). However, CeO2 is one of the rare metals. Therefore, both reduction of supply amount of CeO2 slurry and development of new slurry without CeO2 need to be improved. This paper presents the optimum CMP conditions applying CeO2 slurry as a parameter of slurry concentration, polishing pressure and platen rotational speed. Moreover, we discuss the advantages of Manganese Oxide (Mn2O3) abrasive for replacing CeO2 abrasive. In the result, it is found experimentally that the proposed conditions are efficient in reduction of CeO2 abrasive. Moreover, Mn2O3 abrasive indicates optimum performance for the polishing of glass substrates.
