精密機械
Print ISSN : 0374-3543
半導体結晶のポリシ加工に関する研究(第3報)
超ミクロ引かきかたさによる光学的ポリシ面の加工変質層の検討(その1)
井田 一郎, 新井 湧三, 鈴木 誠
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1963 年 29 巻 341 号 p. 444-451

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In order to investigate the worked layers of polished semiconductor crystals, the ultra microscratching hardness tester has been made in trial, the load of which is given in the range from 10 to 5, 000 mg. By the use of a very sharp diamond triangular pyramid, plastic flow can easily be realized on crystal surfaces, and the widths of scratches are measured by an electron microscope. The relation between the scratching load and the deformation is clarified on optically polished germanium.
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