A slicing technology based on new concept of Multi-Wire-Saw has been developed for high precision and efficiency. This technology is composed of new driving system and new temperature control system. First, to achieve high efficiency, unidirectional wire driving system was adopted. In this system, a very long wire is driven in only one direction at high speed (max 600 m/min), while a wire is driven reciprocally in coventional Multi-Wire-Saw. Second, to achieve high slicing precision, temperature control system has been newly developed, in which cooling oil is circulated to keep the temperature constant on the grooved roller surface during slicing. This system has made it possible to stabilize positions of wire and to minimize wafer bow caused by thermal expansion of grooved rollers during slicing.
