通液溝付き砥石によるセラミックスとその複合材料のクリープフィード研削

抄録

Electroplated and vitrified bonded diamond grinding wheels with unique structure were newly developed which have slots/segments and cooling holes in the wheel working surface for creep feed grinding of ceramic materials. Silicon nitride was ground with 64% of the grinding power required with a conventional wheel. Wear flats of diamond grits on the leading edge and trailing edge of the cutting segments were observed. Residual stresses of the ground surface of ceramics were measured by the X-ray diffraction method. Aluminum reinforced alumina was slightly easier to grind than alumina, but its surface finish was 150% as rough as that of alumina. Carbon fiber reinforced silicon nitride was ground with 44% of the grinding power required for silicon nitride, in the case when the grinding direction was normal to the fibers, but its surface roughness increased by 130% compared with that for silicon nitride. When the grinding direction was longitudinal, the grinding power was 10%, but the surface roughness increased by a factor of four. Specific energy for grinding ceramic composites with the newly developed wheel does not increase with increasing wheel depth of cut up to 8 mm.