非走査マルチビーム共焦点撮像系による高速三次元計測

抄録

This paper describes a high-speed 3-D shape measurement system for in-line semiconductor package inspections. The system is featured with three points in construction. One is an optical sensor for confocal imaging, which we call a non-scanning multiple-beam confocal imaging sensor. The sensor can get a confocal image in a short time because XY-scanning, which is required in conventional confocal microscopes, is not needed. Another is the algorithm that performs accurate reconstruction of the object surfaces from a few confocal images. The last is a mechanism that performs shifting of the focused plane of the sensor quickly. This experimental system can measure objects having a space of 9.6×9.6×0.64 mm in less than 0.4 s with an accuracy of the order of 1 μm.