抄録
At the edge portion of the wafer sliced in ID-Blade sawing, edge-chippings are usually broken out. This has become an important factor which should be improved in the manufacturing process of semiconductor devices. This study aims to reduce the edge chipping size by means of utilizing slurry which mixed a little free abrasive grains into the working fluid. This method brought the buffer effect between diamond grains adhered to the ID-Blade and the edge portion of workpiece. In this paper, reduction of the edge-chipping utilized slurry and influence of engage and disengage angle of ID-Blade to the workpiece are described. Consequently, edge-chipping size at the edge portion of the wafer was reduced compared with the case in which usual working fluid is used and it became small when an engage and disengage angle are shallow.
