抄録
Optimum wafer edge profile to reduce Roll-Off Amount (ROA) was investigated in the polishing process of silicon wafer manufacturing. The distribution of removal rate at wafer periphery for both double-side and single-side polish was estimated by calculating the contact pressure on wafer surface using FEM analysis. It is suggested from the calculation that reduction of ROA would be achieved by shortening the edge width of wafer in both double-side and single-side polish cases. In industry applications, however, other factors such as safety of wafer handling, durability of polishing pad, and feasibility of fabrication, should be taken into account comprehensively during determining the minimum wafer edge width.
