215 Study on Constant Pressure Grinding with EPD Pellets

抄録

With recent advances in miniaturization technologies of electronic parts, the thinning technique of IC chips has also become important. In this study, a fine abrasive grinding wheel, called EPD pellet, was fabricated and a silicon wafer was ground with constant pressure machining. Constant pressure grinding with silica EPD pellets made a mirror surface about 3.4 nm Ra on the silicon wafers. The highest grinding efficiency was about 2.0,twice as much as case of ordinary constant infeed grinding.