Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
Online ISSN : 2424-3086
ISSN-L : 2424-3086
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Study on Non-Crack Glass Machining by Means of UV Laser with Absorbent(Laser processing (continued))
Ippei KONOAkira NAKANISHIShin'ichi WARISAWAMamoru MITSUISHI
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p. 805-810

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Methods of UV laser machining for glass are now highly required. However, cracks generate on glass when the glass is merely irradiated with a laser. One of the solutions is to utilize laser absorbent. In this paper, three kinds of absorbent, i.e. plate-like absorbent, powder absorbent and liquid absorbent, were examined for a groove, a deep hole and a 3D micro channel within glass, respectively. In the experiments, the proper machining conditions were investigated in order to fabricate the microstructure without cracks. As a result, a deep hole and a bending micro channel can be fabricated.
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© 2005 一般社団法人 日本機械学会
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