抄録
Methods of UV laser machining for glass are now highly required. However, cracks generate on glass when the glass is merely irradiated with a laser. One of the solutions is to utilize laser absorbent. In this paper, three kinds of absorbent, i.e. plate-like absorbent, powder absorbent and liquid absorbent, were examined for a groove, a deep hole and a 3D micro channel within glass, respectively. In the experiments, the proper machining conditions were investigated in order to fabricate the microstructure without cracks. As a result, a deep hole and a bending micro channel can be fabricated.
