An Attempt on High-Efficiency, High-Quality and Low Cost Machining of Silicon by Using Two Ni-W Electroplated Micro Diamond Tools with Different Grit Size(M^4 processes and micro-manufacturing for science (continued))

抄録

The present paper deals with the fabrication of Ni-W electroplated micro cylindrical diamond grinding tools with two different grit sizes and their efficient application to the grooving of silicon on a vertical grinding machine. From the tool fabrication test and grooving test the followings are found. In the electroplating process of 2-4μm diameter grits the intermittent stirring of electroplating solution contributed to the uniform deposition of diamond grits on the substrate of tools, In the electroplating process of 8-16μm diameter grits the submerging method is available, because such grits tend to sink so fast. By adjusting the embedding time tool life can be extended. The grooving test showed considerably higher feed rate realized longer tool life using both 2-4μm grit tools and 8-16μm grit tools. Although the efficient roughing by a coarse-grit tool and the subsequent finishing by a fine-grit tool is expected, this method can not be recognized available yet so far from the viewpoint of tool life. The tool life has an approximately positive correlation with grit distribution density on the tool. 2-4μm grit tools are available for a feed rate of 200μm/min from the overall viewpoint of tool life and groove quality.