Research on Chemo-Mechanical-Grinding (CMG) of large size silica glass substrate

抄録

As finishing techniques for silica glass substrate, the free abrasive processes are able to offer a better surface roughness, but sacrifice profile accuracy. On the other hand, the fixed abrasive process or grinding is known as a promising solution to improve accuracy of profile geometry, but always introduces damaged layer. In order to simultaneously achieve both surface quality and profile accuracy, this research has proposed a novel chemo-mechanical-grinding (CMG) process by effective use of chemical reaction in the grinding process.