Monitoring for Ultra-Precision Turning of Single Crystal Silicon using Diamond Tool with Large Nose Radius and Small Chamfer at Cutting Edge

抄録

It is known that brittle materials can be machined like ductile materials when uncut chip thickness is less than critical one. Face turning by using a tool having round edge with small chamfer was carried out to find out effective parameter for distinction between ductile and brittle mode cuttings using by AE signal, cutting forces and vibration acceleration. As a result, the following results were reached. (1) RMS value of AE signal was larger in brittle mode cutting than in ductile mode cutting. (2) Static thrust force per unit area of cutting cross section was larger than in brittle mode cutting.