抄録
In this study, the fundamental polishing characteristic of fixed abrasive polishing by using alumina abrasive grain for single crystal Si was investigated. Pyramidal structured polishing pad including alumina abrasives was used and KOH aqueous solution was used as polishing fluid. As a result, it has been clarified that an optimum concentration of KOH aqueous solution to create a smooth surface has been about 5wt%. In this condition, finished surface roughness has been about 80nmRz. Furthermore, they have been shown that cutting edge has worn hardly and polishing performance has kept in long time polishing without dressing.
