抄録
In this study, a pulsed Nd:YAG laser beam is used as a non-contact thermal dressing tool for a metal bonded diamond wheel. In order to efficiently remove the bond material, it is necessary to direct air on the spot irradiated by the laser so as to blow away the molten binder. The new integrated laser-air head makes it possible to make an appropriate chip pocket depth with less residual re-solidification layer of bond material. The grinding experiments of the hot-pressed SiC reveals that the laser-dressed wheel has somewhat better grinding performance than the conventional rotary dressed wheel.
