抄録
The wafer grinding by use of a diamond grinding wheel is required to create a high-quality wafer surface in a short time. In general, it is known that high-quality wafer surface can be obtained by reducing the amount of material removal per abrasive cutting edge. In other words, an excellent surface quality is obtainable by an increasing in the areal density of effective abrasive cutting edge on the grinding wheel working surface. In this study, we aim to understanding of the three-dimensional distribution of abrasive grains on diamond wheel working surface, from both theoretical and experimental aspects, and evaluation its influence on the grinding performance.
