抄録
Electroplated copper thin films have started to be applied to the interconnection material in TSV structures because of its low electrical resistivity and high thermal conductivity. However, the material properties were found to vary drastically comparing with those of bulk copper. This was because that the microtexture of the electroplated films was found to vary widely depending on their electroplating conditions. In this study, mechanical properties of the films were measured by a nano-indentation test. The result showed that it is very important to control the microtexture of the films to assure the stability and reliability of electronic products.
