抄録
In this paper is presented the results on performance of the cooling model used in the back area of the display using water-cooled system. In recent years, ever ending demand of high performance CPU led to a rapid increase in the amount heat dissipation. Consequently, thermal designing of electronic devices need to consider some suitable approach to achieve high cooling performance in limited space with low noise level. Under the present experimental condition, when the flow rate is 50 l/min, about half of the amount of heat dissipated was cooled by natural convection and radiation, and the rest was cooled by forced convection. A possible way to increase the cooling efficiency by forced convection is to install fins on the heat-dissipating panel.
