熱工学コンファレンス講演論文集
Online ISSN : 2424-290X
セッションID: G116
会議情報
G116 電子機器の強制空冷下での多孔性金属板障害物の影響(電子機器冷却)
藤井 雅雄
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会議録・要旨集 フリー

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抄録
Two rectangular block-like elements as an electronic module are positioned in a parallel-walled channel and cooled by forced convection airflow. A metal plate with holes as a barrier protrudes above the plane of the modules, which is intended to function as a cover for protecting them from mechanical or electromagnetic damage. Per-module heat transfer coefficients in the presence of barriers of various height, H and distance, L between the module and the barrier were measured. In the presence of the barrier with holes, the heat transfer coefficient at two modules is rapidly diminished. Nusselt numbers are correlated as a function of Reynolds number and H/L.
著者関連情報
© 2007 一般社団法人 日本機械学会
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