抄録
A study on monitoring the slicing condition on cutting a silicon crystal ingot by ID(inner-diameter) saw blade is presented. The acoustical and vibration signals during cutting the ingot are measured by a piezoelectric 3-axis load sensor which is fixed onto the mount of the silicon ingot. The collected data is first transformed by FFT analysis and then the logarithm of the power spectrum is decomposed by wavelet transform in order to categorize the state of the wafer surface damage by the signals. Several examples have been discussed and the results show that the proposed signal analysis method is useful for the evaluation of the wafer quality and the slicing condition of ID saw blade.
