抄録
Polysilicon thin films were tensile tested by a thin film tensile tester developed for reliability evaluation of microelectromechanical (MEMS) devices. This tensile tester has a new specimen chucking system using electrostatic force. This method enables us to handle thin (few micrometer thick) specimens easily without damage. The tensile strength of polysilicon specimens is evaluated and some fracture properties are investigated. To study variation of the reported tensile strength of polysilicon films and to check accuracy of the tensile tester, we have participated the cross comparison of tensile testing techniques.
