抄録
Thermal stress fracture in 96% alumina-kovar bonded joints was studied by thermal elasto-plastic analysis. Thermal stress fracture of this joint occured at the center of the alumina plate at about 873K during post bonded heating and the fracture was detected by AE measurements. This phenomena was able to be simulated analytically by thermal elasto-plastic FEM and the stress normal to the direction of the bonded line was found to be a good parameter for thermal stress fracture. As the result of this analysis, it is predicted that the sensitivity of alumina for thermal fracture becomes higher with increasing the plate thickness of Alumina or Ag metallized layer.
