抄録
We have developed an rf sputtering with multipolar magnets around the target in the rf sputtering system of a magnetic Ni (200 mmφ, 5 mm thick) target to deposit Ni thin films. When permanent magnets, made of Nd-Fe-B material with a surface magnetic flux density of 0.57 T, were placed around the Ni target outside the vacuum chamber, a magnetic flux density measured at the position of 5 mm above the target surface was distributed in the range of 0~0.37 T.
It is shown that the deposition rate significantly increases from 3.7 to 5.4 nm/min with values increased up to two times that of a conventional rf sputtering. It is also revealed that the discharge produced by an rf sputtering with external magnets can be sustained at a lower Ar gas pressure of down to 8.0×10-1 Pa.
