抄録
Electrical industry is interested in low Ag SnAgCu solder alloy as alternative Pb-free solder due to higher mechanical reliability and low cost. However, there are few reports for thermal reliability of low Ag SnAgCu solder joint comparing to near eutectic SnAgCu solder joint. In this study, various sizes of MLCC soldered with Sn-0.3Ag-0.7Cu(SAC 0307) solder joint were subjected to thermal shock tests with Sn-3.0Ag-0.5Cu(SAC 305) and Sn-40Pb solder joints.
