正方配列菱面体を仮想充填形式とした擬似三次元的等球粒子堆積シミュレーション
1993 年 19 巻 6 号 p. 1202-1206
詳細
1993 年 19 巻 6 号 p. 1202-1206
Random packing phenomena of equal sized spheres (of micron or submicron size) were simulated assuming a quasi-three-dimensional packing structure based on rhombohedral tetragonal ordination. In the simulation, the probability of particle movement through a packed layer was determined with simple rules in accordance with the contact pattern of particles. The calculated average void fraction was 0.37, a value which agreed with that of random close packing and many previous experimental results with equal spheres.
