抄録
In the case of combined loads such as the simultaneous action of cyclic torsion and plane bending acting on the machine element, neither the first nor second principal stress amplitudes can be detected by the copper electroplating method of stress analysis because this method utilizes the phenomenon that grown grains appear when the maximum shearing stress amplitude in the deposited layer attains the proper value to the plating. In this paper, a unique method adopting copper foil with a microcircular hole that enables separation and measurement of the first and second principal stresses in the element subjected to combined loads at both ends is proposed.
