抄録
The kinetics of dissolution of solid metals, Nickel, Copper and Silver in liquid Bismuth have been studied under static and isothermal conditions over a range of temperatures from 300° to 500°C. The measurements of the solution rate have been carried out by means of an electric resistivity method as well as chemical analysis. For these three systems, the solution rates have been found to obey the unimolecular reaction law expressed in the form of n=n{1−exp(−k·S⁄V·t)} and the solution rate constants are in nearly the same order of magnitude of 10−4 cm/sec. The activation energy of dissolution has been found to be about 2.2, 6.1 and 4.2 Kcal/mol for Ni-Bi, Cu-Bi and Ag-Bi systems, respectively. These experimental results have been discussed from the standpoint that the rate of dissolution is determined by the diffusion of solute atoms through the boundary layer of the solid-liquid metal interface.
