Abstract
The standard electrode potential for Cu is 0.34 V and that of In is −0.34 V, which means that their deposition potentials are far apart, making the co-deposition difficult from a simple solution containing Cu and In ions. In order to bring these deposition potntials closer, a complex forming reagent of citric or EDTA is added to the CuSO4–In2(SO4)3 solution. The effect of these reagents was examined by linear sweep veltammetric measurement. An electrochemical deposition experiment of Cu–In alloy was conducted where effect citric acid or EDTA addition, current density and Cu concentration were examined.
