抄録
Titania gel films were prepared on single-crystal Si wafers from solutions of mole ratio, Ti(OC3H7i)4 : H2O : HNO3 : C2H5OH = 1 : 1 : 0.2 : 30 with or without addition of polyvinylpyrrolidone (PVP) and CH3COOH. The gel films were heated at 5oC/min up to 500oC and then cooled down to room temperature, where stress in films were measured in situ by measuring the substrate curvature with a laser beam. Tensile stress was generated, and basically increased with increasing temperature with an abrupt decrease at around 480oC. When the gel film contained no PVP or CH3COOH, the stress increased steeply at 25 - 100oC. When the gel film contained CH3COOH, on the other hand, the stress increased more sluggishly up to 250oC, and that containing PVP showed extremely sluggish increase in stress up to 300oC with a steep increase over that temperature.
