抄録
Ultra-thin Al2O3 layer, thickness of 10 to 100nm, has been coated on ductile thin substrates e.g. Cu, by atomic layer deposition (ALD) process using tri-methyl aluminum (TMA) and H2O2 as precursor couples. The coated materials were tensile-tested in ambient air at room temperature under various loading rates. Deformability of the coated layer was evaluated from initial cracking strain/stress of the layer during tensile test. After loading up to selected stress, fracture behavior of the layer was observed by optical microscope and SEM. Discussions will be made on the effect of grain-order deformation of Cu substrate on Al2O3 film crack evolution behavior.
