Effect of Photo-crosslinking on Clean Debonding of Acrylic Pressure Sensitive Adhesives from Silicon Wafer

抄録

Photo-crosslinkable acrylic copolymer pressure-sensitive adhesives (PSAs) have many applications in the process of electronic industry. As the silicon wafers become thinner, PSAs need to show proper adhesion performance and better debonding characteristics. The acrylic copolymers were prepared with 2-ethylhexyl acrylate, ethyl acrylate, and acrylic acid by radical solution polymerization followed by chemical modification with glycidyl methacrylate to have the photo-crosslinkable groups in the side chains. The adhesion properties of photo-crosslinked acrylic copolymer PSAs were much dependent on both the content of glycidyl methacrylate and the UV dose which played a crucial role in the extent of crosslinking. The clean debonding of PSAs from silicon wafer surface was easily obtained by effective photo-crosslinking of acrylic copolymers modified with glycidyl methacrylate into fully crosslinked networks resulting from controlling the extent of crosslink and the adhesion strength of photo-crosslinked acrylic copolymer.